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New Route to Improve Thermal Property of Phenolic Resin

✍ Scribed by Cheng, Guang Wen


Book ID
121223961
Publisher
Trans Tech Publications Inc.
Year
2012
Tongue
English
Weight
276 KB
Volume
246-247
Category
Article
ISSN
1660-9336

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The curing reaction of bisphenol-A epoxy resin (BPAER) with boron-containing phenol-formaldehyde resin (BPFR) was studied by isothermal and dynamic differential scanning calorimetry (DSC). The kinetic reaction mechanism in the isothermal reaction of BPAER-BPFR was shown to follow autocatalytic kinet