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New Profile of Ultra Low Stress Resin Encapsulants for Large Chip Semiconductor Devices

✍ Scribed by Nakamura, Y.; Uenishi, S.; Kunishi, T.; Miki, K.; Tabata, H.; Kuwada, K.; Suzuki, H.; Matsumoto, T.

Book ID: 117911698
Publisher: IEEE
Year: 1987
Tongue: English
Weight: 759 KB
Volume: 10
Category: Article
ISSN: 0148-6411
DOI: 10.1109/tchmt.1987.1134798

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