Low-stress resin encapsulants for semiconductor devices : K. Kuwata, K. Iko and H. Tabata. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-8 (4), 486 (1985)

• Book ID: 103281238
• Publisher: Elsevier Science
• Year: 1987
• Tongue: English
• Weight: 139 KB
• Volume: 27
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(87)90244-7