✦ LIBER ✦
New profile of ultra low stress resin encapsulants for large chip semiconductor devices : Yoshinobu Nakamura, Shinjirou Uenishi, Teruo Kunishi, Kazuyuki Miki, Haruo Tabata, Kazuyuki Kuwada, Hideto Suzuki and Tsunetaka Matsumoto. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 502 (1987)
- Book ID
- 103287126
- Publisher
- Elsevier Science
- Year
- 1989
- Tongue
- English
- Weight
- 274 KB
- Volume
- 29
- Category
- Article
- ISSN
- 0026-2714
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