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New epoxy/episulfide resin system for electronic applications. I. Curing mechanism and properties

✍ Scribed by Katsuyuki Tsuchida; James P. Bell

Publisher: John Wiley and Sons
Year: 2000
Tongue: English
Weight: 297 KB
Volume: 79
Category: Article
ISSN: 0021-8995
DOI: 10.1002/1097-4628(20010222)79:8<1359::aid-app30>3.0.co;2-n

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