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A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties

✍ Scribed by Wan-Lung Wu; Kung-Chung Hsu; Wu-Hsun Cheng

Publisher: John Wiley and Sons
Year: 2008
Tongue: English
Weight: 242 KB
Volume: 108
Category: Article
ISSN: 0021-8995
DOI: 10.1002/app.27599

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