The epoxy resin containing a typical mesogenic group such as biphenol was cured with catechol novolak and aromatic diamines which have neighboring active hydrogens. In the biphenol-type epoxy resin cured with catechol novolak, 4,4-diaminodiphenylmethane, and p-phenylenediamine (PPD), the glass-rubbe
Effect of structure of aromatic diamines on curing characteristics, thermal stability, and mechanical properties of epoxy resins. I
β Scribed by Neeraj Gupta; I. K. Varma
- Publisher
- John Wiley and Sons
- Year
- 1998
- Tongue
- English
- Weight
- 326 KB
- Volume
- 68
- Category
- Article
- ISSN
- 0021-8995
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β¦ Synopsis
The curing behavior of diglycidyl ether of bisphenol-A (DGEBA) with aromatic diamines having aryl-ether, aryl-ether-carbonyl, and aryl-ether-sulfone linkages was studied using differential scanning calorimetry (DSC). Aromatic diamines such as 1,3-bis ( aminophenoxy ) benzene ( R ) , 1,4-bis ( aminophenoxy ) benzene ( H ) , 2,2 -bis [ 4-( 4-aminophenoxy ) phenyl ] propane ( B ) , 4,4 -bis ( 4-aminophenoxy ) benzophenone ( P ) , and bis [ 4-( 4-aminophenoxy ) phenyl ] sulfone ( S ) were synthesized and characterized in the laboratory. Curing of DGEBA was done using both stoichiometric and nonstoichiometric amounts of diamines and the reaction was monitored using DSC. The reactivity of the diamines depended on the structure. The presence of electron withdrawing groups, even though significantly apart from the reaction site, reduced the nucleophilicity. No significant change was observed in the activation energy for curing, which was around 56 { 2 kJ /mol. The glass transition temperature of the epoxy network depended on the structure and was higher when diamines P and S were used in comparison to diamines R, H, and B. The cured resins were stable up to 300ΠC, and maximum char yield ( i.e., 32% at 600ΠC ) was obtained in DGEBA cured with diamine P. The room temperature mechanical properties only changed marginally with the structure of the diamines.
π SIMILAR VOLUMES
Epoxy resin (diglycidyl ether of bisphenol A, DGEBA)/cyanate ester mixtures were cured with a curing agent, 4,4-diaminodiphenylsulfone, and the effect of cyanate ester resin on the cure behavior and thermal stability in the epoxy resin was investigated with a Fourier transform infrared spectrometer,
The epoxy resin diglycidyl ether of bisphenol F (DGEBF) was cured by the aliphatic amine curing agent Epicure 3371 in a stoichiometric ratio both frontally and in a batch-cure schedule. Glass transition temperatures ( T g ) were determined using differential scanning calorimetry (DSC) and dynamic me
2,3-Bis(4-aminophenyl)quinoxaline (1a), 2,3-bis(4-aminophenyl)-6-methylquinoxaline (1b), and 5,6-bis(4-aminophenyl)-3-(2-pyridyl)-1,2,4-triazine (2) were studied as curing agents of epoxy resins. The exotherms on differential scanning calorimetry thermograms of the mixtures of diglycidyl ether of bi