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Multichip modules- uniting device and package technology?

✍ Scribed by Roy Szweda

Book ID
103267350
Publisher
Elsevier Science
Year
1992
Tongue
English
Weight
132 KB
Volume
23
Category
Article
ISSN
0026-2692

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πŸ“œ SIMILAR VOLUMES

[IEEE 1998 International Conference on M
[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - A system level approach to a structured MCM design methodology
✍ Ringroot, E.; Truzzi, C.; Beyne, E. πŸ“‚ Article πŸ“… 1998 πŸ› IEEE 🌐 English βš– 853 KB

now In Its Seventh Year, Mcm Has Expanded To Reflect The Evolution And Applications Since 1992. The Mcms Most Commonly Envisioned In 1992 Interconnected 60 To 100 Chips On A Thin Film Substrate.