[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - A system level approach to a structured MCM design methodology

✍ Scribed by Ringroot, E.; Truzzi, C.; Beyne, E.

• Book ID: 111876360
• Publisher: IEEE
• Year: 1998
• Tongue: English
• Weight: 853 KB
• Volume: 0
• Category: Article
• ISBN-13: 9780780348509
• DOI: 10.1109/icmcm.1998.670777

✦ Synopsis

now In Its Seventh Year, Mcm Has Expanded To Reflect The Evolution And Applications Since 1992. The Mcms Most Commonly Envisioned In 1992 Interconnected 60 To 100 Chips On A Thin Film Substrate.