𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Monitoring method and apparatus for chemical-mechanical polishing


Book ID
122837862
Publisher
Elsevier Science
Year
1996
Tongue
English
Weight
250 KB
Volume
94
Category
Article
ISSN
0026-0576

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πŸ“œ SIMILAR VOLUMES


Chemical mechanical polishing for select
✍ M.T. Wang; W.K. Yeh; M.S. Tsai; W.T. Tseng; T.C. Chang; L.J. Chen; M.C. Chen πŸ“‚ Article πŸ“… 1997 πŸ› Elsevier Science 🌐 English βš– 576 KB
Chemical-mechanical polishing of copper
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A systematic study of Cu chemical-mechanical polishing (CMP) in terms of process parameters influence, planarization ability of the process and pattern sensitivity of the polish rate was performed. We examined the effects of Cu dishing and SiO z thinning and the reasons for them. Both were found to