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Modification of epoxy resins with polysiloxane thermoplastic polyurethane for electronic encapsulation: 1

✍ Scribed by Tsung-Han Ho; Chun-Shan Wang

Publisher: Elsevier Science
Year: 1996
Tongue: English
Weight: 789 KB
Volume: 37
Category: Article
ISSN: 0032-3861
DOI: 10.1016/0032-3861(96)87635-x

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