New acrylic elastomers with pendant epoxy groups were used to reduce the brittleness of bisphenol-A diglycidyl ether epoxy resin cured with p,p'-diaminodiphenyl sulphone. The elastomers were prepared by copolymerization of butyl acrylate (BA), vinylbenzyl glycidyl ether (VBGE) and styrene (St) or ac
Toughening of epoxy resins by modification with dispersed acrylate rubber for electronic packaging
β Scribed by Tzong-Hann Ho; Chun-Szhan Wang
- Publisher
- John Wiley and Sons
- Year
- 1993
- Tongue
- English
- Weight
- 531 KB
- Volume
- 50
- Category
- Article
- ISSN
- 0021-8995
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
2-Ethylhexyl acrylateΒ±acrylic acid copolymers, ie carboxyl randomized poly(2-ethylhexyl acrylate) (CRPEHA) (LR-1 to LR-6), with different molecular weights and functionality were synthesized. The liquid rubbers were characterized by FTIR spectroscopic analysis, non-aqueous titration, vapour pressure
Acrylic elastomers with pendant epoxy groups were used to improve the toughness of bisphenol-A diglycidyl ether epoxy resin cured with p,p'-diaminodiphenyl sulphone. The elastomers were prepared by terpolymerization of butyl acrylate (BA), glycidyl methacrylate (GMA) and acrylonitrile (AN) or styren
A series of acrylic copolymer modifiers with mesogenic side chain (LCGMB) were synthesized and used to modify E-51/DDM system. The dynamic mechanical behavior and impact strength of the modified systems were investigated. The results showed that the impact strength and modulus were influenced by the
N-phenylmaleimide-styrene-p-hydroxystyrene terpolymers (PMSH), containing pendant p-hydroxyphenyl groups as functionalities, were prepared and used to improve the toughness of bisphenol-A diglycidyl ether epoxy resin cured with p,p'-diaminodiphenyl sulphone. The terpolymers were effective as modifie