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Modification of epoxy resins by hydrosilation for electronic encapsulation application

✍ Scribed by Tzong-Hann Ho; Chun-Shan Wang

Publisher: John Wiley and Sons
Year: 1994
Tongue: English
Weight: 828 KB
Volume: 54
Category: Article
ISSN: 0021-8995
DOI: 10.1002/app.1994.070540102

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