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Modeling of Reactive Diffusion: Mechanism and Kinetics of the Intermetallics Growth in Ag/Ag Interconnections

✍ Scribed by R. Filipek; K. Szyszkiewicz; P. Dziembaj; P. Skrzyniarz; A. Wierzbicka-Miernik; P. Zieba

No coin nor oath required. For personal study only.

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