Growth kinetics of the intermetallic phase in diffusion-soldered (Cu–5 at.%Ni)/Sn/(Cu–5 at.%Ni) interconnections

✍ Scribed by Wierzbicka-Miernik, A.; Miernik, K.; Wojewoda-Budka, J.; Szyszkiewicz, K.; Filipek, R.; Litynska-Dobrzynska, L.; Kodentsov, A.; Zieba, P.

• Book ID: 123479198
• Publisher: Elsevier Science
• Year: 2013
• Tongue: English
• Weight: 828 KB
• Volume: 142
• Category: Article
• ISSN: 0254-0584
• DOI: 10.1016/j.matchemphys.2013.08.022