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Modeling Material Properties of Lead-Free Solder Alloys

✍ Scribed by Zhanli Guo; Nigel Saunders; Peter Miodownik; Jean-Philippe Schillé


Book ID
107454958
Publisher
Springer US
Year
2007
Tongue
English
Weight
515 KB
Volume
37
Category
Article
ISSN
0361-5235

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