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Model for the barrier diffusion into Cu interconnects at high temperatures

✍ Scribed by Oliver Aubel; Wolfgang Hasse; Martina Hommel; Heinrich Koerner

Book ID: 108207512
Publisher: Elsevier Science
Year: 2005
Tongue: English
Weight: 259 KB
Volume: 82
Category: Article
ISSN: 0167-9317
DOI: 10.1016/j.mee.2005.07.063

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