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10-nm-thick quinary (AlCrTaTiZr)N film as effective diffusion barrier for Cu interconnects at 900 °C

✍ Scribed by Chang, Shou-Yi; Chen, Dao-Sheng


Book ID
118739974
Publisher
American Institute of Physics
Year
2009
Tongue
English
Weight
746 KB
Volume
94
Category
Article
ISSN
0003-6951

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