✦ LIBER ✦
A Study on the Breakdown Mechanism of an Electroless-Plated Ni(P) Diffusion Barrier for Cu/Sn/Cu 3D Interconnect Bonding Structures
✍ Scribed by Byunghoon Lee; Haseok Jeon; Seong-Jae Jeon; Kee-Won Kwon; Hoo-Jeong Lee
- Book ID
- 107457375
- Publisher
- Springer US
- Year
- 2011
- Tongue
- English
- Weight
- 535 KB
- Volume
- 41
- Category
- Article
- ISSN
- 0361-5235
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