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Microstructuring of non-conductive silicon carbide by electrical discharge machining

✍ Scribed by Zeller, Florian; Hösel, Tim; Müller, Claas; Reinecke, Holger


Book ID
125349100
Publisher
Springer-Verlag
Year
2013
Tongue
English
Weight
605 KB
Volume
20
Category
Article
ISSN
0946-7076

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Smoothly polished single-crystal silicon plates were cut by wire electrical discharge machining (WEDM) in water and in oil in order to investigate the effect of WEDM on the polished surfaces. For cutting in water, polished surfaces near cut sections have chips and cracks, and are extremely rough; th