Cutting of polished single-crystal silic
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Hideo Takino; Toshimitsu Ichinohe; Katsunori Tanimoto; Syuichi Yamaguchi; Kazush
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Article
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2004
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Elsevier Science
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English
โ 302 KB
Smoothly polished single-crystal silicon plates were cut by wire electrical discharge machining (WEDM) in water and in oil in order to investigate the effect of WEDM on the polished surfaces. For cutting in water, polished surfaces near cut sections have chips and cracks, and are extremely rough; th