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High-quality cutting of polished single-crystal silicon by wire electrical discharge machining

โœ Scribed by Hideo Takino; Toshimitsu Ichinohe; Katsunori Tanimoto; Syuichi Yamaguchi; Kazushi Nomura; Masanori Kunieda


Book ID
108252157
Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
580 KB
Volume
29
Category
Article
ISSN
0141-6359

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Cutting of polished single-crystal silic
โœ Hideo Takino; Toshimitsu Ichinohe; Katsunori Tanimoto; Syuichi Yamaguchi; Kazush ๐Ÿ“‚ Article ๐Ÿ“… 2004 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 302 KB

Smoothly polished single-crystal silicon plates were cut by wire electrical discharge machining (WEDM) in water and in oil in order to investigate the effect of WEDM on the polished surfaces. For cutting in water, polished surfaces near cut sections have chips and cracks, and are extremely rough; th