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High efficiency fine boring of monocrystalline silicon ingot by electrical discharge machining

โœ Scribed by Yoshiyuki; Akira Okada; Yasuhiro Okamoto; Kazuo Yamazaki; Subhash H Risbud; Yoshiaki Yamada


Book ID
108400683
Publisher
Elsevier Science
Year
1999
Tongue
English
Weight
949 KB
Volume
23
Category
Article
ISSN
0141-6359

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High efficiency slicing of low resistanc
โœ W. Wang; Z.D. Liu; Z.J. Tian; Y.H. Huang; Z.X. Liu ๐Ÿ“‚ Article ๐Ÿ“… 2009 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 972 KB

As the semiconductor industry requires the cutting of silicon ingots into wafers, the slicing of large, ultra thin wafers is one of the main technologies to prevent wastage. Recently, apart from conventional inner diameter (ID) blade and multi-wire saw methods, wire electrical discharge machining (W