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Microstructure, thermal and mechanical properties of nanostructured Cu-5.5Ni-9.2Sn-6.5P

✍ Scribed by T.M. Wang; J. Li

Publisher: Elsevier Science
Year: 1995
Tongue: English
Weight: 316 KB
Volume: 94
Category: Article
ISSN: 0038-1098
DOI: 10.1016/0038-1098(95)00038-0

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