✦ LIBER ✦

Microstructure formation in Sn-Cu-Ni solder alloys

✍ Scribed by M. Felberbaum; T. Ventura; M. Rappaz; A. K. Dahle

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Intermetallic Formation and Fluidity in

✍ C. M. Gourlay; K. Nogita; J. Read; A. K. Dahle 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 957 KB

The Maximum Fluidity Length of Solidifyi

✍ C.M. Gourlay; J. Read; K. Nogita; A.K. Dahle 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 654 KB

Microstructure of interfacial reaction l

✍ Han-Byul Kang; Jee-Hwan Bae; Jeong-Won Yoon; Seung-Boo Jung; Jongwoo Park; Cheol 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 388 KB

Microstructure and mechanical properties

✍ C. M. L. Wu; D. Q. Yu; C. M. T. Law; L. Wang 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 787 KB

Formation of Intermetallics in Sn-0.9Cu

✍ Tina Ventura; Young-Hee Cho; Chun Kong; Arne K. Dahle 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 355 KB

Microstructural development of Sn-Ag-Cu

✍ Andreas R. Fix; Gabriel A. López; Ingo Brauer; Wolfgang Nüchter; Eric J. Mitteme 📂 Article 📅 2005 🏛 Springer US 🌐 English ⚖ 719 KB