✦ LIBER ✦

Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging

✍ Scribed by Hu Hao; Yaowu Shi; Zhidong Xia; Yongping Lei; Fu Guo

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Microstructure Evolution and the Constit

✍ Harry Schoeller; Shubhra Bansal; Aaron Knobloch; David Shaddock; Junghyun Cho 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 666 KB

Intermetallics Characterization of Lead-

✍ Anupam Choubey; Hao Yu; Michael Osterman; Michael Pecht; Fu Yun; Li Yonghong; Xu 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 865 KB

Shear strength of the Zn–Sn high-tempera

✍ R. Mahmudi; M. Eslami 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 471 KB

Impression Creep Behavior of Zn-Sn High-

✍ R. Mahmudi; M. Eslami 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 725 KB

Microstructure, solderability, and growt

✍ C. M. T. Law; C. M. L. Wu; D. Q. Yu; L. Wang; J. K. L. Lai 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 242 KB

Effect of high-temperature annealing on

✍ Peng Jiang; Yongchang Liu; Chen Wei; Jingbo Wan; Ronglei Xu; Zhiming Gao 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 435 KB