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Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging

โœ Scribed by Anupam Choubey; Hao Yu; Michael Osterman; Michael Pecht; Fu Yun; Li Yonghong; Xu Ming

Book ID
107455194
Publisher
Springer US
Year
2008
Tongue
English
Weight
865 KB
Volume
37
Category
Article
ISSN
0361-5235

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Comparison of isothermal mechanical fati
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
โœ C. Andersson; Z. Lai; J. Liu; H. Jiang; Y. Yu ๐Ÿ“‚ Article ๐Ÿ“… 2005 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 424 KB

Low-cycle isothermal mechanical fatigue testing of bulk solders and solder joints of eutectic Sn-37 wt% Pb, Sn-3.5 wt% Ag and Sn-4.0 wt% Ag-0.5 wt% Cu were carried out at room temperature over a wide range of strains (1-10%). The fatigue results of both bulk and solder joints were compared; the eute