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Microstructure and mechanical properties predicted by indentation testing of lead-free solders

✍ Scribed by T. Ogawa; R. Kaga; T. Ohsawa

Publisher: Springer US
Year: 2005
Tongue: English
Weight: 574 KB
Volume: 34
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-005-0218-y

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