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Microstructure and high temperature creep strength of Si3N4

✍ Scribed by P.H.M. Nilsson; G.L. Dunlop


Publisher
Elsevier Science
Year
1984
Tongue
English
Weight
93 KB
Volume
13
Category
Article
ISSN
0304-3991

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A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si 3 N 4 joints were obtained. The effect of Ti content on the microstructure and properties of the Si 3 N 4 joints was investigated using EPMA, SEM and three-point bendin