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Microstructural investigation of electrodeposited CuAg-thin films

✍ Scribed by S. Strehle; S. Menzel; H. Wendrock; J. Acker; K. Wetzig

Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
823 KB
Volume
70
Category
Article
ISSN
0167-9317

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✦ Synopsis

In this article we present microstructural investigations of electrodeposited CuAg-alloy metallization thin films. The deposition was carried out on Si(100) / SiO / Ta / TaN / Cu-seed substrates at room temperature without any additives. It was 2 found that the mean grain size decreases with increasing dc current density whereas a dependence on the Ag content was not observed. Additionally the crystalline structure and, particularly, the formation of CuAg-solid solutions and grain boundary segregation is discussed on the basis of XRD measurements. The Ag content within a supersaturated copper matrix increases with increasing dc current density.

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