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Effect of deposition parameters on microstructure of electrodeposited nickel thin films

โœ Scribed by Amaresh Chandra Mishra; Awalendra K. Thakur; V. Srinivas

Publisher
Springer
Year
2009
Tongue
English
Weight
569 KB
Volume
44
Category
Article
ISSN
0022-2461

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In this article we present microstructural investigations of electrodeposited CuAg-alloy metallization thin films. The deposition was carried out on Si(100) / SiO / Ta / TaN / Cu-seed substrates at room temperature without any additives. It was 2 found that the mean grain size decreases with increas