✦ LIBER ✦

Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions

✍ Scribed by Jeong-Won Yoon; Hyun-Suk Chun; Ja-Myeong Koo; Hoo-Jeong Lee; Seung-Boo Jung

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Characteristics of Sn-2.5Ag flip chip so

✍ Kyoung Chun Yang; Seong Hyuk Lee; Jong-Min Kim; Young Ki Choi; Dave F. Farson; Y 📂 Article 📅 2009 🏛 Springer-Verlag 🌐 English ⚖ 654 KB

Microstructure Evolution of Cu-Cored Sn

✍ Xianzhang Sa, Ping Wu 📂 Article 📅 2013 🏛 Springer US 🌐 English ⚖ 531 KB

The influence of Sn–Cu–Ni(Au) and Sn–Au

✍ N. Duan; J. Scheer; J. Bielen; M. van Kleef 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 793 KB