Utilizing the difference in interface strength due to fabrication process, a technique for producing a sharp pre-crack between a thin film and a substrate is proposed. A cracked specimen for examining fracture toughness of interface between a sputtered copper (Cu) thin film and silicon (Si) is made
โฆ LIBER โฆ
Micromechanisms and Mechanics of Damage and Fracture in Thin Film/Substrate Systems
โ Scribed by L. L. Mishnaevsky; D. Gross
- Book ID
- 111586644
- Publisher
- Springer US
- Year
- 2004
- Tongue
- English
- Weight
- 202 KB
- Volume
- 40
- Category
- Article
- ISSN
- 1573-8582
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