Pre-cracking technique for fracture mechanics experiments along interface between thin film and substrate
✍ Scribed by Hiroyuki Hirakata; Takayuki Kitamura; Takato Kusano
- Book ID
- 104017531
- Publisher
- Elsevier Science
- Year
- 2005
- Tongue
- English
- Weight
- 497 KB
- Volume
- 72
- Category
- Article
- ISSN
- 0013-7944
No coin nor oath required. For personal study only.
✦ Synopsis
Utilizing the difference in interface strength due to fabrication process, a technique for producing a sharp pre-crack between a thin film and a substrate is proposed. A cracked specimen for examining fracture toughness of interface between a sputtered copper (Cu) thin film and silicon (Si) is made by the method. A vacuum-evaporated Cu thin film, which has poor adhesion to Si, is inserted between the sputtered Cu thin film and the Si substrate as a release layer. The release layer debonds from the Si substrate at very low load, and the sharp pre-crack is successfully introduced along the interface. Using the pre-cracked specimen, the interface fracture toughness test is conducted and the critical J-integral, J C , is evaluated as about 1 J/m 2 for the sputtered Cu/Si interface.