This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelec
Microelectronics Packaging Handbook: Technology Drivers Part I
β Scribed by Eugene J. Rymaszewski, Rao R. Tummala, Toshihiko Watari (auth.), Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein (eds.)
- Publisher
- Springer US
- Year
- 1997
- Tongue
- English
- Leaves
- 741
- Edition
- 2
- Category
- Library
No coin nor oath required. For personal study only.
β¦ Synopsis
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, coolΒ ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
β¦ Table of Contents
Front Matter....Pages i-xxvii
Front Matter....Pages 1-1
Microelectronics PackagingβAn Overview....Pages 3-128
Package Wiring and Terminals....Pages 129-198
Package Electrical Design....Pages 199-313
Heat Transfer in Electronic Packages....Pages 314-403
Package Reliability....Pages 404-555
Package Manufacture....Pages 556-619
Back Matter....Pages 621-720
β¦ Subjects
Circuits and Systems; Control Structures and Microprogramming; Manufacturing, Machines, Tools; Electrical Engineering
π SIMILAR VOLUMES
<br> Content: An analysis of process issues with chemically amplified positive resists / O. Nalamasu, A.G. Timko, Elsa Reichmanis, F.M. Houlihan, Anthony E. Novembre, R. Tarascon, N. MuΜnzel, and S.G. Slater --<br/> The annealing concept for environmental stabilization of chemical amplification resi
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a
A complete walk-through of the conversion from standard leadβtin to lead-free solder microelectronic assemblies for low-end and high-end applications, this timely reference analyzes the health risks associated with lead; estimates the environmental benefits of using lead-free substitutes in microele
<p><P><EM>RF and Microwave Microelectronics Packaging</EM> presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding le