The feasibility of copper metallization for interconnections in ultra-large scale integrated circuits is under evaluation in the ESPRIT/JESSI project COIN (Copper INterconnections). Research has been performed comprising all basic aspects of copper metallization for integrated circuits, such as deve
Metallization technologies for ULSI
✍ Scribed by JM Martínez-Duart; JM Albella
- Publisher
- Elsevier Science
- Year
- 1989
- Tongue
- English
- Weight
- 809 KB
- Volume
- 39
- Category
- Article
- ISSN
- 0042-207X
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