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๐Ÿ“

MEMS Materials and Processes Handbook

โœ Scribed by Tina L. Lamers, Beth L. Pruitt (auth.), Reza Ghodssi, Pinyen Lin (eds.)


Publisher
Springer US
Year
2011
Tongue
English
Leaves
1224
Series
MEMS Reference Shelf 1
Edition
1
Category
Library

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โœฆ Synopsis


MEMS Materials and Processes Handbook is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on 'Materials' and 'Processes'. The extensive 'Material Selection Guide' and a 'Material Database' guides the reader through the selection of appropriate materials for the required task at hand. The 'Processes' section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs. The book also: Provides a comprehensive catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMS Discusses specific MEMS fabrication techniques such as additive, subtractive, and lithography/patterning, as well as wafer bonding, doping, surface treatment/preparation, and characterization techniques Provides the reader with a quick check list of the advantage/disadvantage of fabrication MEMS Material and Processes Handbook will be a valuable book for researchers, engineers and students working in MEMS and materials processing.

โœฆ Table of Contents


Front Matter....Pages i-xxxv
The MEMS Design Process....Pages 1-36
Additive Processes for Semiconductors and Dielectric Materials....Pages 37-136
Additive Processes for Metals....Pages 137-191
Additive Processes for Polymeric Materials....Pages 193-271
Additive Processes for Piezoelectric Materials: Piezoelectric MEMS....Pages 273-353
Materials and Processes in Shape Memory Alloy....Pages 355-402
Dry Etching for Micromachining Applications....Pages 403-456
MEMS Wet-Etch Processes and Procedures....Pages 457-665
MEMS Lithography and Micromachining Techniques....Pages 667-753
Doping Processes for MEMS....Pages 755-815
Wafer Bonding....Pages 817-877
MEMS Packaging Materials....Pages 879-923
Surface Treatment and Planarization....Pages 925-1044
MEMS Process Integration....Pages 1045-1181
Back Matter....Pages 1183-1187

โœฆ Subjects


Electronics and Microelectronics, Instrumentation; Materials Science, general; Circuits and Systems; Surfaces and Interfaces, Thin Films


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