The interdependence between the curing conditions, structure, and the mechanical properties of tow neat phenolic resin systems was investigated. Changes of the distribution of the void diameters were characterized by light-an scanning electron microscope analyses. Tensile tests and dynamic mechanica
✦ LIBER ✦
Mechanism of the dielectric and mechanical β-dispersion in the thermosetting phenolic resins
✍ Scribed by Yuzo Takahashi
- Publisher
- John Wiley and Sons
- Year
- 1962
- Tongue
- English
- Weight
- 97 KB
- Volume
- 6
- Category
- Article
- ISSN
- 0021-8995
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