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The curing mechanism and properties of bismaleimide–biscyanamide resin

✍ Scribed by Masao Suzuki; Akira Nagai; Masahiro Suzuki; Akio Takahashi

Publisher
John Wiley and Sons
Year
1992
Tongue
English
Weight
406 KB
Volume
44
Category
Article
ISSN
0021-8995

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The interdependence between the curing conditions, structure, and the mechanical properties of tow neat phenolic resin systems was investigated. Changes of the distribution of the void diameters were characterized by light-an scanning electron microscope analyses. Tensile tests and dynamic mechanica