Mechanism of growth of the open circuit insulating Oxide films on valve metals
โ Scribed by Dr. H. A. Abd El-Rahman
- Publisher
- John Wiley and Sons
- Year
- 1991
- Tongue
- English
- Weight
- 503 KB
- Volume
- 22
- Category
- Article
- ISSN
- 0933-5137
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โฆ Synopsis
Abstract
The kinetics of growth of the open circuit insulating oxide films on Hf, Ta, Nb, Zr and Al were studies in many salt solutions using potential and capacitance measurements. The effect of salt type and concentration, oxygen concentration, temperature and surface pretreatment on the growth kinetics were also investigated. In all cases, the potential and the reciprocal capacitance were found to increase linearly with logarithm of time. It is assumed that the oxide film grows via the solid state mechanism under the influence of highly enough electric field strength to cause the ionic migration. The field is created as a result of the adsorption of the electrolyte anions onto the metal oxide surface. The estimated field strengths (H โ๏ธ 10^6^ V cm^โ1^) are in favour with the proposed mechanism. The results showed also that the growth rate constant is a function of the field strength.
๐ SIMILAR VOLUMES
The potentlostatlc anodlc oxide growth on Al, Nb, Ta and TI shows deviations from the high field model, eg an overshootmg current The formation of mobile lomc space charges by an emlsslon of anions and cations from the interfaces explams the shape of the transients, the coupling of amon and cation m
## Abstrae -The behaviour of titanium in 3.0 moldm-" H,SO, has been studied by in situ ellipsomtiry. The growth and subsequent dissolution of the anodic oxide under opcn-eireuit conditions have been characterised and in addition evidence for the formation of a suboxide layer hetween the metal and