Mechanism of electrodeposition and dissolution processes of copper in aqueous solutions
โ Scribed by Bockris, J. O'M.; Enyo, M.
- Book ID
- 120048589
- Publisher
- Royal Society of Chemistry
- Year
- 1962
- Weight
- 890 KB
- Volume
- 58
- Category
- Article
- ISSN
- 0014-7672
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
Galvanostatic single-pulse, rotating-disc and chronopotentiometric measurements on etched polycrystalline copper electrodes in semimolar mixed solutions of CuS04, MgSOL and HISO at 25ยฐC have yielded kinetic parameters and specific rate data for either of the two consecutive chargetransfer steps of t
The cathodic deposition of Cu on Pt from DMF, ACN and MeOH solutions has been investigated by chronopotentiometric method. The electrodeposition processes are irreversible. The cathodic reactions are complicated by adsorption processes. In the presence of the Cl-ions in DMF and ACN the cathodic wave