Mechanical Properties of Ternary Sn-In-Ag Ball-Grid Array Assemblies at Ambient and Elevated Temperatures

✍ Scribed by M. S. Yeh; J. T. Chiang

• Book ID: 107458400
• Publisher: Springer US
• Year: 2009
• Tongue: English
• Weight: 618 KB
• Volume: 18
• Category: Article
• ISSN: 1059-9495
• DOI: 10.1007/s11665-008-9337-y