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Mechanical properties of intermetallic compounds on lead-free solder by moiré techniques

✍ Scribed by Iting Tsai; Enboa Wu; S. F. Yen; T. H. Chuang


Book ID
110627061
Publisher
Springer US
Year
2006
Tongue
English
Weight
486 KB
Volume
35
Category
Article
ISSN
0361-5235

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