Analysing the growth of intermetallic compounds in lead-free solder joints by differential scanning calorimetry measurements

✍ Scribed by Schreck, Timo; Schnorpfeil, Anna; Kaloudis, Michael

• Book ID: 118801506
• Publisher: Springer
• Year: 2012
• Tongue: English
• Weight: 415 KB
• Volume: 48
• Category: Article
• ISSN: 0022-2461
• DOI: 10.1007/s10853-012-7035-5