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Mechanical properties of In-based eutectic alloy solders used in Josephson packaging

✍ Scribed by J.T.C. Yeh

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

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✍ Fujiwara, K.; Asahi, M. 📂 Article 📅 1987 🏛 IEEE 🌐 English ⚖ 565 KB

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✍ Shchetinskiy, A.V.; Dedyukhin, A.S.; Volkovich, V.A.; Yamshchikov, L.F.; Maishev 📂 Article 📅 2013 🏛 Elsevier Science 🌐 English ⚖ 634 KB

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✍ Kang, S. K.; Lauro, P.; Shih, D.-Y.; Henderson, D. W.; Puttlitz, K. J. 📂 Article 📅 2005 🏛 IBM 🌐 English ⚖ 749 KB

A Significant Improvement in Mechanical

✍ Jiang, Yong Jun 📂 Article 📅 2013 🏛 Trans Tech Publications, Ltd. 🌐 English ⚖ 278 KB

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✍ I. I. Kurbatkin; D. A. Podgornyi; N. V. Chepelenko 📂 Article 📅 2007 🏛 Allerton Press, Inc. 🌐 English ⚖ 295 KB