๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Materials issues in area-array microelectronic packaging

โœ Scribed by D. R. Frear


Book ID
107524965
Publisher
The Minerals, Metals & Materials Society
Year
1999
Tongue
English
Weight
809 KB
Volume
51
Category
Article
ISSN
1047-4838

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โœ Seri Lee; Malcolm Early; Mark Pellilo ๐Ÿ“‚ Article ๐Ÿ“… 1997 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 540 KB

The operation of near/y cvcvy electronic device generates heat, from the microprocessors used in computers, to mobile phone.Thc laws of physics dictate t/tat the performance and reliability of electronics and other integrated circuit dcvi,:es are absolutely constrained by device temperatures. Mathem