A dual-magnetron system for deposition inside tubular substrates has been developed. The two magnetrons are facing each other and have opposing magnetic fields forcing electrons and thereby also ionized material to be transported radially towards the substrate. The depositions were made employing di
Magnetron sputtering system stabilisation for high rate deposition of AlN films
β Scribed by Alexey A Fomin; Vladislav Akhmatov; Sergey V Selishchev
- Publisher
- Elsevier Science
- Year
- 1998
- Tongue
- English
- Weight
- 574 KB
- Volume
- 49
- Category
- Article
- ISSN
- 0042-207X
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β¦ Synopsis
The stabilisation of a planar magnetron sputtering system for reactive sputtering ofAlN in a gaseous mixture ofAr and highly active NH, was examined. The helical instability in the cathode plasma sheath was observed and methods for its damping were proposed. It was found that the deposition oft-axis oriented AIN films at high deposition rates in the range 0.5-3.0 m/h is possible, when the helical instability in the magnetron system is damped.
π SIMILAR VOLUMES
Detailed characterization of a newly developed sputtering system consisting of two symmetrically inclined unbalanced magnetron sputtering devices, to be used for ion-assisted deposition of two component alloy thin films, is made. The working characteristics of the double magnetron system are compare
Applications insulated metal substrates (IMS) for high-density and high-power mounting are greatly extending with miniaturizing of electronic components. Recently, aluminum nitride film has been used as a potential insulator and/or passivation material in insulated metal substrate because of its hig