✦ LIBER ✦

Low-temperature full wafer adhesive bonding

✍ Scribed by Niklaus, Frank; Enoksson, Peter; Kälvesten, Edvard; Stemme, Göran

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Low-temperature silicon wafer bonding

✍ H.J. Quenzer; W. Benecke 📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 987 KB

Low-temperature wafer-level transfer bon

✍ Niklaus, F.; Enoksson, P.; Griss, P.; Kalvesten, E.; Stemme, G. 📂 Article 📅 2001 🏛 IEEE 🌐 English ⚖ 136 KB

Patterned wafer bonding using ultraviole

✍ Rui Zhuo; Guanglan Liao; Wenliang Liu; Lei Nie; Tielin Shi 📂 Article 📅 2011 🏛 Springer-Verlag 🌐 English ⚖ 250 KB

Plasma-assisted InP-to-Si low temperatur

✍ Pasquariello, D.; Hjort, K. 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 443 KB

Low temperature epoxy bonding for wafer

✍ Yong-Kook Kim; Eun-Kyung Kim; Soo-Won Kim; Byeong-Kwon Ju 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 805 KB

A Si/SiGe MOSFET utilizing low-temperatu

✍ S. Koliopoulou; P. Dimitrakis; D. Goustouridis; S. Chatzandroulis; P. Normand; D 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 242 KB