Low cost fabrication of microelectrodes on plastic substrate
β Scribed by Yan Xu; Long-Biao Huang; Kai-Leung Yung; Yun-Chuan Xie; Thomas Ming-Hung Lee
- Publisher
- Springer-Verlag
- Year
- 2011
- Tongue
- English
- Weight
- 510 KB
- Volume
- 17
- Category
- Article
- ISSN
- 0946-7076
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
A new low-cost UV LIGA process using photoresists as sacrificial layers has been developed to fabricate micromechanical components and systems. Commonly used photoresists are spun on a substrate and patterned by a mask aligner. Free-standing metal structures are built by patterning a second layer of
Mechanically reinforced Ag-clad Hastelloy tapes were fabricated as the inexpensive substrates for coated conductors without any buffer layer. The clad substrate has good adhesion between Ag and Hastelloy layers. Superconducting YBa 2 Cu 3 O 7 (YBCO) films were directly deposited on Ag-clad Hastelloy