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Cost efficient master fabrication process on copper substrates

✍ Scribed by Simone Luigi Marasso; Giancarlo Canavese; Matteo Cocuzza


Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
615 KB
Volume
88
Category
Article
ISSN
0167-9317

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Fabrication of fine copper lines by sele
✍ S. Vidal; A. Gleizes; D. Davazoglou πŸ“‚ Article πŸ“… 2001 πŸ› Elsevier Science 🌐 English βš– 771 KB

Fine copper lines, with a width of less than 1 mm, were fabricated on silicon substrates. For the fabrication, oxidized (100) silicon substrates were used, covered with a film grown by LPCVD at 0.1 Torr and 5508C from W(CO) decomposition. 6 These substrates were subsequently covered with AZ 5214E ph