✦ LIBER ✦
Localized Ligand Induced Electroless Plating (LIEP) Process for the Fabrication of Copper Patterns Onto Flexible Polymer Substrates
✍ Scribed by Alexandre Garcia; Jérôme Polesel-Maris; Pascal Viel; Serge Palacin; Thomas Berthelot
- Publisher
- John Wiley and Sons
- Year
- 2011
- Tongue
- English
- Weight
- 686 KB
- Volume
- 21
- Category
- Article
- ISSN
- 1616-301X
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